1/4 rev. a structure silicon monolithic integrated circuit product series 1ch motor driver for digital still camera type bd6369gul features ? built in 1 constant-voltage drivers ? absolute maximum ratings (ta=25c) parameter symbol limit unit power supply voltage vc c -0.5 to +6.5 v motor power supply voltage vm -0.5 to +6.5 v control input voltage vin -0.5 to vcc+0.5 v input voltage for constant-voltage setting vlim -0.5 to vm+0.5 v power dissipation pd 730 1 mw operating temperature range topr -25 to +85 c junction temperature tjmax 150 c storage temperature range tstg -55 to +150 c h-bridge output current iout -500 to +500 2 ma/ch 1 reduced by 5.84mw/c over 25c, when mounted on a glass epoxy board (50mm ? 58mm ? 1.75mm; 8 layers) 2 must not exceed pd, aso, or tjmax of 150c. ? operating conditions (ta= -25c to +85c) parameter symbol min. typ. max. unit power supply voltage vcc 2.5 3.0 5.5 v motor power supply voltage vm 2.5 5.0 5.5 v control input voltage vin 0 - vcc v input voltage for constant-voltage setting vlim 0 - vm v h-bridge output current iout - - ? 400 3 ma 3 must not exceed pd or aso. this product isn?t designed for protection against radioactive rays.
2/4 rev. a ? bd6369gul electrical characteristics (unless ot herwise specified ta=25c, vcc=3.0v, vm=5.0v) parameter symbol limit unit conditions min. typ. max. overall circuit current during standby operation iccst - 0 10 a ps=0v circuit current1 icc - 0.9 1.4 ma ps=vcc with no signal circuit current2 im - 0.4 0.65 ma ps=vcc, vlim=5v with no signal control input (vin=ina, inb, sel, ps) high level input voltage vinh 2.0 - - v low level input voltage vinl - - 0.7 v high level input current iinh 15 30 60 a vin=3v low level input current iinl -1 0 - a vin=0v pull-down resistor rin 50 100 200 k ? constant-voltage control input input current ivlim -1.5 -0.5 - ua vlim=0v uvlo uvlo voltage vuvlo 1.6 - 2.4 v constant-voltage drive block output on-resistance ron - 0.8 1.2 ? io= ? 400ma on high and low sides in total output h voltage voh 1.9x vlim 2.0x vlim 2.1x vlim v vlim=1v, 10 ? load turn-on time ton - 1.5 5 s io= ? 150ma , 10 ? load turn-off time toff - 0.1 2 s io= ? 150ma , 10 ? load rise time tr - 2 8 s io= ? 150ma , 10 ? load fall time tf - 0.05 1 s io= ? 150ma , 10 ? load input-output table constant-voltage drivers input output logic sel ina inb outa outb l l x z 4 z 4 l h l h l l h h l h h l l l l h l h l h h h l h l h h h z 4 z 4 h : high, l : low, x : don?t care 4 z in constant-voltage drivers is a state that po wer mos has been turned off with the top and bottom. but feed back resistance (20 k ? : typ) for output h voltage setting is connected between outx and gnd. ? output voltage control output h voltage voh [v] = 2.0 vlim[v] (typ.) voh [v] = vm[v] (vlim > vm/2)
3/4 rev. a ? package outline ? pin arrangement (top view) top view side view bottom view ? block diagram ? pin no. and pin name 1 2 3 4 a n.c. outa ps n.c. b vm inb ina c pgnd vlim sel vcc d n.c. outb gnd n.c. no. pin name 1a n.c. 2a outa 3a ps 4a n.c. 1b vm 2b 3b inb 4b ina 1c pgnd 2c vlim 3c sel 4c vcc 1d n.c. 2d outb 3d gnd 4d n.c. fig.1 vcsp50l2 package (unit: mm) fig.2 bd6369gul pin arrangement (top view) a a v lot no. 1pin mark 2.1 0.1 2.1 0.1 0.1 0.05 0.55 ma x s 0.08 s a b p = 0.5 3 0.3 0.1 0.3 0.1 15 0.25 0.05 0.05 a b ( 0.15 ) index post d c b a 1 2 3 4 p = 0.5 3 0.5 fi g .3 bd6369gul block dia g ram bandgap power save vcc tsd & uvlo outa vm pgnd 2 outb h bridge level shift & pre driver logic gnd sel ps ina inb vlim 2c 2a 3a 1b 3b 4b 1c 3c 4c 2d 3d
4/4 rev. a ? output ac characteristic ? operation notes (1) absolute maximum ratings use of the ic in excess of absolute maximum ratings su ch as the applied voltage or operating temperature range (topr) may result in ic damage. assumptions should not be made regarding the state of the ic (short mode or open mode) when such damage is suffered. the implementation of a physical safety measure such as a fuse should be considered when use of the ic in a spec ial mode where the absolute maximum ratings may be exceeded is anticipated. (2) power supply lines regenerated current may flow as a result of the motor's back electromotive force. insert capacitors between the power supply and ground pins to serve as a route for regenerated current. determine the capacitance in full consideration of all the characteristics of the electrolytic capacitor, because the electrolytic capacitor may loose some capacitance at low temperatures. if the connecte d power supply does not have sufficient current absorption capacity, regenerative current will cause the vo ltage on the power supply line to rise, which combined with the product and its peripheral circuitry may exceed the absolute maximum ratings. it is recommended to implement a physical safety measure such as the inse rtion of a voltage clamp diode between the power supply and gnd pins. (3) ground potential ensure a minimum gnd pin potential in all operating conditions. (4) setting of heat use a thermal design that allows for a sufficient margin in light of the power dissipat ion (pd) in actual operating conditions. (5) actions in strong magnetic field use caution when using the ic in t he presence of a strong m agnetic field as doing so may cause the ic to malfunction. (6) aso when using the ic, set the output transistor for the motor so that it does not exceed absolute maximum ratings or aso. (7) thermal shutdown circuit this ic incorporates a tsd (thermal shutdown) circuit (t sd circuit). if the temperatur e of the chip reaches the following temperature, the motor coil output will be open ed. the thermal shutdown circuit (tsd circuit) is designed only to shut the ic off to prevent runaway ther mal operation. it is not designed to protect the ic or guarantee its operation. do not continue to use the ic after operating this circuit or use the ic in an environment where the operation of this circuit is assumed. tsd on temperature [c] (typ.) hysteresis temperature [c] (typ.) 175 25 (8) ground wiring pattern when using both small signal and large current gnd patte rns, it is recommended to isolate the two ground patterns, placing a single ground point at the application' s reference point so that the pattern wiring resistance and voltage variations caused by large currents do not c ause variations in the small signal ground voltage. be careful not to change the gnd wiring pattern of any external components, either. 100% 0% 100% 0% -100% ton ton toff toff tf tr tf tr 50% 50% 50% 50% -50% -50% 90% 10% -10% -90% -90% -10% 10% 90% iout vin
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